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  1. Home
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  3. EXSEAL CO., LTD. Head office
  4. We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices."
SEMINAR_EVENT
  • May 20, 2024
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May 20, 2024

We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices."

EXSEAL CO., LTD. EXSEAL CO., LTD. Head office
We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices," a trade show that contributes to the development of the entire electronic circuit industry and related sectors. At our booth, we will showcase products that are active in the semiconductor industry! You can actually see samples and try them out for confirmation. ○ Ideal for holding and storing precision parts and chips! Siloxane-free precision parts transport case with "domestic/fully non-silicone specifications"【Gel Base】 ○ For dust removal from printed circuit boards and devices, and for picking small parts! Reusable adhesive pen for foreign matter collection that can be "washed with water"【Gel Cleaner Pen】 ○ Perfect for removing fine dust from fingertips! Can be reused by washing with water! Adhesive gel for fingertips with "non-silicone specifications & no plasticizers"【Tip Remover】 We sincerely look forward to your visit. ★ Visit us here ★ Total Solutions Exhibition for Electronic Devices ◎ Dates: June 12 (Wednesday) - 14 (Friday), 2024, 10:00 AM - 5:00 PM ◎ Venue: Tokyo Big Sight (East Exhibition Hall) ◎ Booth Number: 6H-10
Gel-based image
Gel-based image
Total Solution Banner for Electronic Devices
Total Solution Banner for Electronic Devices
Date and time Wednesday, Jun 12, 2024 ~ Friday, Jun 14, 2024
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight (East Exhibition Hall) No. 6H-10
Entry fee Free If you register in advance for your visit, the admission fee will be free.
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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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Silicone-free semiconductor chip transport case "Gel Base V Type"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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For cleaning the base! Gently removes dust from details with the 'Gel Cleaner Pen'

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dust using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worry about glue transfer! Since it captures dust with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

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Domestic Short Delivery Adhesive-Free Transport Chip Tray 'Gel Base'

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

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Static electricity prevention! 'Semiconductive gel sheet' that can transfer dust from gloves and other items.

Are you troubled by dust caused by static electricity? A sheet that can transfer and adsorb dust with the power of urethane gel!

This is a sticky sheet that transfers and adsorbs dust attached to gloves and antistatic gel rollers. It is made of urethane gel material and does not transfer adhesive. It has antistatic properties, making it usable in places where static electricity is undesirable. It has a high dust collection effect. 【Key Points of Antistatic Gel Sheet】 ■ Static electricity prevention effect! This sticky sheet has antistatic properties, allowing it to be used in environments where static electricity is a concern. The surface resistance value is 10⁸Ω. ■ No adhesive used! Made from urethane gel material, it removes dust using the gel's self-adhesive properties, so no adhesive materials are used. There is no worry about adhesive transferring to gloves, antistatic gel rollers, gel cleaner pens, etc. ■ Washable to restore stickiness! Reusable! When it gets dirty, washing it with water removes the dirt, and once dried, the stickiness is restored. It is not disposable and can be used repeatedly. *For more details, please feel free to contact us.

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Related catalog(6)

Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

PRODUCT
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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

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Finger Adhesive Gel 'Tip Remover' Leaflet

Finger Adhesive Gel 'Tip Remover' Leaflet

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Glove and Roller Dust Transfer Adhesive Sheet 'Electroconductive Gel Sheet' Leaflet

Glove and Roller Dust Transfer Adhesive Sheet 'Electroconductive Gel Sheet' Leaflet

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EXSEAL CO., LTD.
Resin/Plastic
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Notice of Participation in the 8th Coating Japan Paint and Coating Equipment Exhibition from November 12 (Wednesday) to November 14 (Friday), 2025.

  • NEW
  • SEMINAR_EVENT

Our company will be exhibiting at the "16th Advanced Functional Materials Week Tokyo" held at Makuhari Messe, specifically at the "8th Coating Japan: Paints and Coating Equipment Exhibition." This exhibition is a specialized event where functional paints, coating equipment, surface treatment technologies, and more will be showcased all in one place. A wide range of engineers from industrial fields such as electronics and automotive to architecture and building materials will be in attendance. At this exhibition, you can discover new products and technologies, consult directly with engineers, discuss estimates and implementation timelines, and learn about industry trends. We sincerely look forward to your visit.

Oct 21, 2025

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Accelerating Material Development DX! We will exhibit at the High-Performance Materials Week Tokyo from November 12 to 14.

  • NEW
  • SEMINAR_EVENT

■Accelerating Next-Generation Polymer Design: Digital Chemistry Platform■ With the evolution of molecular simulation technology, we have entered an era where phenomena at the atomic and molecular levels can be reproduced and analyzed on computers. Furthermore, by combining this with machine learning, it has become possible to achieve high-precision material predictions and designs even with limited experimental data. Schrödinger strongly supports the enhancement of your analytical capabilities and the efficiency of research and development through cutting-edge molecular simulation and AI/ML technologies, as well as our unique digital platform that integrates these technologies. At this exhibition booth, our specialized staff will clearly introduce an overview of these technologies and case studies, and will also answer any questions you may have. *During the exhibition, we will hold a seminar at our booth. Location: Our exhibition booth Theme: Accelerating Next-Generation Polymer Material Development with Machine Learning and Atomic-Level Simulation 【Exhibition Information】 Exhibition Name: 14th High-Performance Plastics Exhibition within High-Functionality Materials Week Dates: November 12 (Wednesday) to 14 (Friday), 2025, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Halls 1-3 Booth Number: 15-10

Oct 21, 2025

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We will exhibit at Automotive World from October 29 to 31, 2025, at Port Messe Nagoya.

  • NEW
  • SEMINAR_EVENT

We will showcase flexible busbars that can also be used in vehicles. Additionally, we will display various power supplies for precision welding machines, as well as automatic machines and processing electrodes.

Oct 21, 2025

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On October 24 (Friday) at 11:00, our company’s Kiuchi will be speaking at the "Latest Technology Session by NVIDIA Partners" during the 2025 Japan IT Week [Autumn]!

  • NEW
  • SEMINAR_EVENT

NVIDIA, a partner company of ADLINK Japan, will hold the "Latest Technology Session by NVIDIA Partners" at the 2025 Japan IT Week [Autumn], where ADLINK Japan's Kiuchi will present on the theme "Introduction to Embedded AI Solutions for TCO Reduction." This is an open seminar that is free and does not require prior registration, so please join us.

Oct 21, 2025

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Notice of Participation in EdgeTech+2025

  • NEW
  • SEMINAR_EVENT

This exhibition is one of the largest comprehensive exhibitions for embedded and edge technology in Japan, focusing on design philosophy based on AI, secure by design, and building resilient supply chains. It provides an overview of the entire embedded ecosystem, covering everything from institutional and market trends to on-site implementation, allowing attendees to experience the forefront of transformation in embedded technology. At the D-Link booth, we will introduce our "4G/5G M2M products," which can be widely used from offices and stores to embedded devices, factory equipment, and in-vehicle systems, along with the cloud management platform "D-ECS" that streamlines operations after implementation. We will also showcase the "DIS series," an industrial switch with excellent durability, featuring a wide operating temperature range from -40°C to 75°C and compliance with IP protection ratings.

Oct 21, 2025

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