We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices."

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

• Other electronic parts

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

• Other electronic parts

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dust using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worry about glue transfer! Since it captures dust with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

• others

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

• Other safety and hygiene products

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

• Other electronic parts

Are you troubled by dust caused by static electricity? A sheet that can transfer and adsorb dust with the power of urethane gel!

This is a sticky sheet that transfers and adsorbs dust attached to gloves and antistatic gel rollers. It is made of urethane gel material and does not transfer adhesive. It has antistatic properties, making it usable in places where static electricity is undesirable. It has a high dust collection effect. 【Key Points of Antistatic Gel Sheet】 ■ Static electricity prevention effect! This sticky sheet has antistatic properties, allowing it to be used in environments where static electricity is a concern. The surface resistance value is 10⁸Ω. ■ No adhesive used! Made from urethane gel material, it removes dust using the gel's self-adhesive properties, so no adhesive materials are used. There is no worry about adhesive transferring to gloves, antistatic gel rollers, gel cleaner pens, etc. ■ Washable to restore stickiness! Reusable! When it gets dirty, washing it with water removes the dirt, and once dried, the stickiness is restored. It is not disposable and can be used repeatedly. *For more details, please feel free to contact us.

• others

At the Dry Fog Humidification System Free Demo Experience, you will have the opportunity to actually experience our Dry Fog, as well as our single-fluid and dual-fluid humidifiers. We will explain the differences from conventional humidifiers and the effects of implementation. In addition to introducing the latest case studies, we will also provide time for you to consult directly with our specialized staff. Please select a convenient venue and date from the application page and apply. * The "morning session" and "afternoon session" contain the same content. Please participate at a time that suits you. * This event is intended for users only. Participation from trading companies, other companies in the same industry, or for sales purposes to our company is not permitted. Venues: ■ Yamagata Venue: 3/12 (Wed) at Yamagata International Exchange Plaza 3/13 (Thu) at Sakata Chamber of Commerce and Industry ■ Sendai Venue: 3/14 (Fri) at Kiri no Ikeuchi Sendai Branch ■ Tokyo Venue & Osaka Venue: 3/18 (Tue), 3/19 (Wed), 3/21 (Fri) at Kiri no Ikeuchi Tokyo Sales Office & Kiri no Ikeuchi Osaka Headquarters ■ Nagoya Venue & Fukuoka Venue: 4/9 (Wed), 4/10 (Thu), 4/11 (Fri) at Kiri no Ikeuchi Nagoya Sales Office & Kiri no Ikeuchi Fukuoka Sales Office

[Speaker] Mr. Manabu Kamitani, Manager, Performance Unit, Arthur D. Little Japan K.K. [Key Lecture Content] In recent years, both quantum technology and AI have seen technological development and investment at the national level, not just by companies, in various countries. While private enterprises are advancing the verification of the potential and promise of both quantum and AI technologies, the societal penetration of these technologies differs due to the uncertainty of their evolution. This has led to a demand for advanced technological intelligence capabilities that balance the maturity of the technology with expectations for its application in business development and internal implementation based on cutting-edge technologies. This lecture will multifacetedly examine the key points of how to utilize developing advanced technologies, taking into account the current understanding and future direction of quantum technology and AI. [Lecture Items] 1. Current status of the utilization of quantum technology and AI 2. Future development directions of quantum technology and AI and challenges toward realization 3. Considerations for business development and planning for advanced technologies based on the current status and challenges 4. Summary of today's discussion 5. Q&A / Business card exchange

[Speaker] Takayuki Furuta, Director of the Future Robot Technology Research Center (fuRo), Executive Director of Chiba Institute of Technology [Key Lecture Content] The true value of robotic technology lies in its ability to directly impact the physical world, creating tangible value for society, from economic activities to people's daily lives. This lecture will focus on the evolution of robotic technology as a core system that connects cyberspace and the real world, introducing development examples of AI-equipped mobility. Furthermore, while considering the latest trends in robotic technology being utilized in real society, we will explore the future direction and potential of technological development. Additionally, we will indicate the direction that Japan's industry and technology should aim for in the future and reflect on the grand design of society and technology necessary for its realization. [Lecture Items] 1. The essence of robotic technology and its social value 2. The fusion of AI and robotics 3. Development examples of AI mobility 4. How robotic technology is transforming industry and society 5. The grand design of Japan's technology and industry 6. Q&A / Business card exchange *The lecture content may be subject to change based on the latest trends.

[Speaker] Tetsuji Narita, President of NRT Energy Bridge Co., Ltd. [Key Lecture Content] Due to the rapid expansion of AI data centers, the power system is transitioning from "ensuring quantity" to "simultaneous design of reliability, environmental value, and construction period." While the government is taking steps to ensure system capacity in collaboration with watt-bit and in GX strategy regions, on-site, different entities such as DC operators, retailers, power generation and storage, local governments, and transmission companies tend to operate in different languages. This lecture will organize the current state of the system from PPA to practical design of power source portfolios, providing a checklist for each stakeholder and a common language to "operate on the same schedule." [Lecture Items] 1. Overall Overview: Structural organization of how AI DC has become a "design variable" in the power system 2. Current state of watt-bit collaboration and connection discipline 3. GX strategy regions (DC aggregation type): Issues in industrial cluster design 4. Practical design of PPA and power source portfolio 5. Preparation for environmental value and 24/7 CFE 6. Summary: Stakeholder-specific checklist and common schedule 7. Q&A / Business card exchange

[Speaker] Kazuhiro Kaiho, Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Key Lecture Content] Decarbonization of automobiles is entering a phase where EVs, hydrogen, and RNG are utilized according to the industrial structure of countries and regions, energy resources such as renewable energy and biomass, and infrastructure constraints, rather than being solely focused on EVs. This presentation will compare the U.S. tax credits, LCFS, and RFS; China's NEV promotion policies and hydrogen demonstrations; and Europe's RED III and AFIR, organizing which fuels each region is aiming to expand for which applications. It will highlight different winning strategies for passenger and commercial vehicles and provide insights for Japanese companies. [Lecture Items] 1. Why is it important to view "automotive fuel policy" through regional comparisons now? 2. United States: Expanding RNG, hydrogen, and low-carbon fuels through market incentives. 3. China: A dual-front strategy focusing on EVs while nurturing hydrogen for commercial vehicles. 4. Europe: Advancing EVs, hydrogen, and renewable gas through regulatory leadership. 5. Insights for Japanese companies: What should Japan learn and how should it proceed? 6. Q&A / Business card exchange.