[Takumina Product Information] High viscosity 300,000 mPa·s compatible! We have released the latest information on the non-pulsating pump VPL that does not apply shear.

A high-viscosity pump born from on-site feedback! We propose process improvements.

Smooth Flow Pump that Solves All Pump-Related Problems and Dissatisfactions from Research and Development to Process The 'VPL' can handle high-viscosity liquids exceeding 300,000 mPa·s. It can transport a wide range of liquids from water-like fluids to paste-like high-viscosity liquids. Durable structure against wear. There are no shaft seals, eliminating concerns about liquid leakage or foreign matter contamination. **Features of the VPL Pump** - Does not damage the transported liquid - Contamination-free - Resistant to wear - Easy disassembly and assembly **Other Features** - Does not stir the liquid or apply localized pressure - No shaft seals, so there are no concerns about liquid leakage or foreign matter contamination - No rotating or sliding parts in the liquid contact area, ensuring a wear-resistant structure - Compact design of the liquid contact area prevents wasting valuable liquids - No sliding parts, eliminating concerns about heat generation or failure due to dry running - Can be disassembled without special tools, and residual liquid can be easily wiped away The Smooth Flow Pump offers a lineup that accommodates various usage conditions and liquids, including flow rate, pressure, liquid viscosity, discharge accuracy, slurry diameter and material, installation and transport conditions, and cost. Please feel free to contact us, as we will help you select and introduce the most suitable product for your needs.

• Positive Displacement Pump
• Flow Control
• Other Pumps

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

By digitizing contract operations, you can reduce many costs, including stamp duty and mailing fees. ◆ Four Benefits of Electronic Contracts - Cost reduction for printing, stamp duty, mailing fees, and original document storage - Improved business efficiency through system-based sending and stamping - Prevention of tampering with timestamps - Enhanced document searchability 【Many Benefits for the Other Party as Well!】 - Both parties can confirm that the document has not been tampered with - No worry about losing the original paper documents - Increased operational efficiency due to the absence of mailing and binding hassles - Quick contract conclusion through email or system verification ◆ Disadvantages of Electronic Contracts - Costs for implementing and operating the service - Need to ensure that business partners understand electronic transactions ----------------------------------------------------- 　　Consult with paperlogic for electronic contract services! -----------------------------------------------------

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.