PFAS Regulation Countermeasures! ■■ Leak Test Equipment for Small Electronic Components｜MSA-0101 series ■■ Does not use fluorinated inert fluids. PFAS-free. Offers accuracy equal to or better than liquid immersion testing.

PFAS-free! Why not switch from using fluorinated inert liquids for liquid immersion testing to pressure leak testing for airtightness inspection?

As an alternative inspection method to liquid immersion testing (leak testing) using per- and polyfluoroalkyl substances (PFAS), Fukuda Corporation has been providing airtight testing equipment using pressure change leak testing methods for some time. The 'MSA-0101 series' is the latest airtight testing equipment for sealed products that confirms gross leaks. It is designed for small-scale applications such as testing during device development and random airtight inspections. (For mass production testing or line integration, we offer fully automated testing equipment in the 'MS series.') The product size for inspection ranges from small devices measuring a few millimeters to medium-sized devices up to 80 × 70 mm, which can be accommodated by manufacturing measurement jigs (cores).

• Other measurement, recording and measuring instruments
• Leak Testing Equipment
• Environmental Test Equipment

PFAS-free, confirming the waterproofing of electronic devices with air leak tests!

In the electronics industry, the waterproofing of products is a crucial factor that affects reliability. The intrusion of moisture can lead to corrosion and short circuits in circuits, potentially resulting in product failure. Particularly for electronic devices used outdoors or products intended for use around water, high waterproof performance is required. The MSA-0101 series efficiently tests the waterproof performance of electronic devices through PFAS-free air leak testing. 【Usage Scenarios】 - Waterproof testing for smartphones, keyless switches, various small sensors, etc. - Prototype evaluation during the development stage - Random sampling inspection 【Benefits of Implementation】 - Reduced environmental impact due to PFAS-free materials - Lower running costs through air leak testing - Capable of accommodating devices from small to medium sizes

• Other measurement, recording and measuring instruments
• Leak Testing Equipment
• Environmental Test Equipment

PFAS-free! Ensuring the airtightness of semiconductor devices with air leak testing.

In the semiconductor industry, the airtightness of encapsulation is crucial for enhancing product reliability. In devices exposed to temperature changes and vibrations, even minor leaks from the encapsulation can lead to performance degradation or failure. The MSA-0101 series addresses these challenges with PFAS-free air leak testing. 【Application Scenarios】 - Airtightness inspection in the encapsulation process of semiconductor devices - Prototype evaluation during the development stage - Random sampling inspection 【Benefits of Implementation】 - Reduction of environmental impact due to PFAS-free materials - Lower running costs through air leak testing - Compatible with small to medium-sized devices

• Other measurement, recording and measuring instruments
• Leak Testing Equipment
• Environmental Test Equipment

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed