Is ENIG a substitute for ENEPIG in wire bonding?

Regarding wire bonding, ENEPIG can be considered as the initial option. ENEPIG is regarded as one of the most stable surface finishes for wire bonding, but its production cost is significantly higher compared to other surface finishes. Here, there is a solution to use ENIG with an increased gold thickness of 5u" instead of ENEPIG. Below are the conditions and results of tensile tests demonstrating the performance of ENEPIG and ENIG.
Test Conditions:
Using T1.0 mil gold wire, the tensile strength should be above 3 grams force (in accordance with TM-650 2.4.42.3).
PCB A has an ENEPIG finish with Ni: 200u", Pd: 2u", Au: 2u".
PCB B has an ENIG finish with Ni: 200u", Au: 5u".
Results:
PCB A: 5.091 ~ 11.186 (g)
PCB B: 4.432 ~ 12.030 (g)
In summary, it can be concluded that both ENEPIG and ENIG are suitable for wire bonding.


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