Microsection inspection of PCB

Microsection inspection is an important quality analysis method for evaluating interlayer connections and conductor shapes in printed circuit boards (PCBs). This inspection method is typically performed on completed PCBs to ensure that the conductors between each layer meet design requirements and production standards, or to sample and analyze specific locations in case of defects in the product to identify the causes of abnormalities.
When conducting microsection inspection, a sample of a specific size is first cut from the completed PCB, and its surface is polished to reveal the internal structure. Then, a microscope is used to observe and photograph the microsection, showing the vias, conductive layers, and dielectric layers of the PCB.

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