TileFlow Japan will exhibit at Data Center Japan 2025.

Achievement No. 1: Thermal Analysis Simulation System for Data Centers - A simulation system that enables energy-saving predictions directly usable by DC operations managers.

TileFlow is a thermal airflow analysis software specifically designed for data centers. It accurately responds to the increasing demands for energy efficiency year after year with the advanced algorithm (Exponential Method) developed by S.V. Patankar. On-site personnel can handle equipment additions and layout changes themselves. Results can be visualized quickly and easily. As a user-friendly software for operations managers, it is the number one software with a proven track record among major data centers, especially in the United States. It can integrate with various DCIM software to visualize the current state and conduct future considerations. Awarded the Special Prize in the Management & Monitoring category at InteRop Tokyo 2017 and was a finalist in the Demonstration category at InteRop Tokyo 2016.

• Other information systems

Data center thermal management simulation software available for operational managers to use in daily tasks with DCIM integration.

TileFlow is a thermal airflow analysis software specifically designed for data centers. It accurately responds to the increasing demands for energy efficiency year after year with advanced algorithms developed by S.V. Patankar. On-site personnel can handle equipment additions and layout changes themselves. Results can be visualized quickly and easily. For data center operations managers, it has a proven track record as a highly efficient operational software, particularly in the United States and among major data centers. We are available for a demo presentation, so please feel free to request it. It is also possible to conduct this via a web conference. We can provide experiential training upon request through our company website. InteRop Tokyo 2017 Special Award in the Management & Monitoring category

• Thermo-fluid analysis
• Other core systems

User-friendly multi-purpose 27U scalable blanking panel for 19-inch racks and universal multi-purpose baffle system (shielding panel) flame retardant.

High flame-retardant sheet Flame-retardant standard UL94 V-0, compliant with RoHS directive. The material is a non-conductive, inert polypropylene compound. The official name for the 19-inch blank panel is PlenaFill. The shielding panel used for underfloor applications is PlenaForm. The vertical space shielding panel for wide racks is PlenaVertical. Each is sold in box units made of the same material. Pricing and other details will be provided by the distributor. Reference standard prices (revised January 2024, prices effective after February 1): The standard price for PlenaFill is 1 box of 270U (installation rivets not included) at ¥197,800. The price for PlenaForm is open. The price for PlenaVertical is 1 box of 540U (installation rivets not included) at ¥160,000. The price for S99PlenaVertical is 1 box of 540U (installation rivets not included) at ¥100,000. These products are being utilized by major data centers, including those in the United States. They are recommended for purchase and effectiveness by the U.S. Department of Energy. For detailed explanations and sample requests, please feel free to contact us.

• Server Rack

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

Ejectors tend to be avoided due to their enormous consumption of compressed air. However, they also have many advantages, such as noise reduction, no heat generation, and no vibrations. When used properly, they can also achieve energy savings. ■ Space-saving, noise reduction, and heat prevention! Goodbye, electric pumps Large ejectors are ideal for replacing electric pumps. Their impact is significant and greatly contributes to improving the environment in manufacturing sites. Moreover, maintenance can be done without tools. For more details, visit: https://www.ipros.jp/catalog/detail/718575

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed without causing any thermal impact on the base material. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.