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  3. EXSEAL CO., LTD. Head office
  4. Notice of Participation in 'OPIE'25' from April 23 (Wednesday) to April 25 (Friday), 2025.
SEMINAR_EVENT
  • Apr 02, 2025
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Apr 02, 2025

Notice of Participation in 'OPIE'25' from April 23 (Wednesday) to April 25 (Friday), 2025.

EXSEAL CO., LTD. EXSEAL CO., LTD. Head office
Exil Co., Ltd. will be exhibiting at 'OPIE '25' held at Pacifico Yokohama. This exhibition is one of the largest specialized trade shows in Japan, gathering the latest technologies, products, and information in light and laser. The latest research results and products related to optical technology and photonics will be showcased, with approximately 18,000 attendees expected, including development engineers and researchers from universities, research institutions, and companies. At our booth, we will feature products active in the optical industry! You can see samples in person and try them out. ■ Perfect for holding and storing precision parts and chips! 'Completely silicone-free' siloxane-free precision parts transport case [Gel Base] 'Siloxane-free' semiconductor chip transport case [Gel Base V Type] ■ For dust removal from printed circuit boards and devices, and for picking small parts! 'Reusable with water washing' foreign matter collection adhesive pen [Gel Cleaner Pen] ■ Ideal for removing fine dust from fingertips! Reusable with water washing! 'Non-silicone and plasticizer-free' adhesive gel for fingertips [Tip Remover] We sincerely look forward to your visit.
Date and time Wednesday, Apr 23, 2025 ~ Friday, Apr 25, 2025
10:00 AM ~ 05:00 PM
Capital ■Venue: Pacifico Yokohama ■Booth Number: L-49 ■Address: 1-1-1 Minatomirai, Nishi Ward, Yokohama City, Kanagawa Prefecture, 220-0012 ■Nearest Stations - Minatomirai Line, Minatomirai Station (about a 5-minute walk) - JR Negishi Line, Keihin-Tohoku Line, Sakuragicho Station (about a 12-minute walk)
Entry fee Free *Pre-registration system*
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"Gel Base" to prevent damage inside the transport case for precision parts.

Solve problems such as electronic device failures due to siloxane and impacts during transportation with the non-silicone case "Gel Base"!

When transporting precision parts, do you have any of these concerns? - The product was damaged due to impact during transport... - Electronic components failed due to siloxane emitted from silicone cases... - Static electricity affected the parts... The transport case 'Gelbase' developed by Exile protects products from shaking and impact during transport with its soft urethane gel sheet and the gel's self-adhesiveness. Additionally, because it is non-silicone, there is no risk of siloxane, which can cause failures during transport, and it is also treated to prevent static electricity, contributing to a reduction in defective products during transport. You can choose the sheet shape, size, color, and height according to your application. ★ Currently offering samples ★ If you are interested, please check the materials or contact us through our website. 【Features】 ■ Non-silicone ■ No adhesive transfer to parts ■ Stackable trays and cases ■ Can be picked up without a vacuum device due to surface irregularities

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Silicone-free semiconductor chip transport case "Gel Base V Type"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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Domestic Short Delivery Adhesive-Free Transport Chip Tray 'Gel Base'

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

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Non-silicone specification semiconductor precision parts transport case "Gel Base"

Sample giveaway! For holding and storing precision parts and chips. Protects precision parts and allows for pickup without a vacuum device!

The soft gel prevents damage during the transport of precision parts from vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as silicone is not used in the material. 【Key Points of Gel Base】 ■ Non-Silicone! There is no concern about transfer since silicone is not used in the material. ■ No glue transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no glue transfer to the parts. ■ Anti-static treatment! Conductivity is imparted to the material, preventing electrostatic damage to the parts. ■ Stackable trays and cases! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up without a vacuum device! The cloudy mesh type has a surface with irregularities, allowing for pickup without a vacuum device. *For more details, please download the materials or contact us through our website.

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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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For transporting precision parts! Chip and component holding sheet 'Gel Base Sheet'

Are you struggling with product defects in chips and precision parts? Prevent device failures with adhesive-free, non-silicone holding sheets!

The soft gel prevents damage during the transport of precision parts due to vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as it does not use silicone in the material. This is a non-silicone sheet that can be attached to cases for temporary fixation of parts or laid on workbenches for holding. **Key Points of the Gel Base** - **Non-Silicone!** The material does not contain silicone. - **No Glue Transfer to Parts!** The load-bearing surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. - **Static Electricity Prevention!** The material is endowed with conductivity to prevent static destruction of parts. - **Can Be Cut with Scissors, Size Adjustable!** The sheet can be cut with scissors, allowing you to use it according to the size of your cases or trays. - **Can Be Picked Up Without a Vacuum Device!** The cloudy mesh type has a textured surface, allowing for pickup without a vacuum device.

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"Gentle Dust Removal" Foreign Object Collection Adhesive Pen 'Gel Cleaner Pen'

Gently removes dust with the softness and stickiness of the gel! Catches fine dust without damaging circuit boards and other surfaces!

The soft gel prevents damage from vibrations during the transport of precision parts. Since it does not use adhesive materials, there is no worry about glue transfer to the parts. 【Important Points of the Gel Cleaner Pen】 ■ Does not scratch parts! Due to its soft material, it can remove dust without scratching chips or devices. ■ No glue transfer to parts! It uses self-adhesive gel to pick up dirt, so it does not use adhesive materials, and there is no transfer of glue to the device. ■ Reusable! Dirt can be transferred to a transfer sheet or washed away with water, allowing it to be cleaned effectively. Once dried, its adhesive properties are restored, making it reusable. ■ For picking parts! Utilizing the gel's adhesion, it can also be used for picking up small parts. ■ Choose from different pen tip shapes! There are four types of pen tip shapes available, allowing you to choose according to your needs. *For more details, please download the materials or contact us through our website.

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

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Related catalog(6)

Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

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Leaflet for the "Gel Base Sheet" for temporary fixation of precision devices.

Leaflet for the "Gel Base Sheet" for temporary fixation of precision devices.

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Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Finger Adhesive Gel 'Tip Remover' Leaflet

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EXSEAL CO., LTD.
Resin/Plastic
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【2/18-20 | Nagoya】High-Performance Materials Week 1st Mobility Materials Exhibition

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Our company will be exhibiting at the "1st Mobility Material Exhibition during High-Performance Material Week." We sincerely look forward to your visit.

Jan 16, 2026

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[Seminar] NTT Docomo Business Innovation Center's Initiatives and Outlook for 2030

  • NEW
  • SEMINAR_EVENT

[Speaker] Yuichi Ikejiro, Deputy Director, Innovation Center, NTT Docomo Business Inc. [Key Lecture Content] NTT Docomo Business is responsible for corporate ICT business within the NTT Group. It provides a one-stop solution for corporate clients across the entire group, aiming to solve social issues and become a platform for industrial and regional digital transformation (DX) through support for large enterprises and local small and medium-sized enterprises. In this context, the Innovation Center plays a role in exploring and nurturing new business ideas, driving the creation of new businesses and their implementation in society. In this lecture, I would like to introduce the initiatives aimed at creating new businesses utilizing advanced technologies such as AI and IOWN that are promoted by the Innovation Center. [Lecture Items] 1. About NTT Docomo Business / Innovation Center 2. Technology roadmap looking towards 2030 3. Creation of new businesses through open innovation 4. Value creation promoted through design thinking 5. Initiatives for business creation utilizing advanced technologies such as AI, IoT/OT, and IOWN 6. Q&A / Business card exchange

Jan 16, 2026

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[Seminar] The Frontlines of New Hegemonic Competition and Business Redesign

  • NEW
  • SEMINAR_EVENT

[Speaker] President and CEO of ICT Solution Consulting Co., Ltd. / Creator Takashi Tominaga [Lecture Topics] 1. Review of last year's future predictions 2. Signs of a major upheaval (from 10 news stories) 3. Background of the major upheaval (triggered by Trump 2.0) - The U.S.-China space war and the emergence of disruptors (not innovators but destroyers) - Disruptors' destructive business models (subscription services, overwhelming cost competitiveness) 4. The essence of the major upheaval - The intersection of two massive revolutions (VC revolution and operation revolution) 5. What the major upheaval brings (making industry hierarchy (scale) meaningless) - Industries disintegrating (the risk of existing industries being taken over by platforms, especially in finance, healthcare, administration, national defense, IT, etc.) - Companies disintegrating (the possibility of bankruptcies of companies exceeding one trillion yen, encirclement by disruptors from small and medium-sized enterprises with technology) - Operations disintegrating (operation models using minimal human resources) - Employees disintegrating (the disappearance of the middle class, talent filtering by AI) 6. Overcoming the major upheaval and the concept of transformation (metamorphosis) 7. Q&A and business card exchange

Jan 16, 2026

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[Seminar] The Frontlines of Financial Regulation Surrounding Stablecoins and Payment/Remittance Businesses

  • NEW
  • SEMINAR_EVENT

[Instructor] Ryo Sekiguchi, Attorney at Horii Law Office (Japan/New York State) [Key Lecture Content] Against the backdrop of rapid technological advancements and the spread of cashless payments, services related to fund settlement have rapidly diversified, with payment methods utilizing decentralized ledger technology, such as stablecoins, emerging recently. On the other hand, with the diversification of payment and remittance services, providers of fund settlement services are required to comply with various financial regulations from the perspectives of user protection, prevention of fraudulent use, and AML/CFT, among others. These legal regulations have also been frequently amended recently. Most recently, a law partially amending the Fund Settlement Act was enacted in June 2025, with implementation scheduled for this year. Therefore, in the fund settlement business, it is essential to properly understand various legal regulations and to always pay attention to trends in the amendments of these regulations. In this seminar, we will briefly explain the overall picture of financial regulations related to payment and remittance businesses, and we will focus on explaining various remittance and payment services, particularly those parts affected by recent legal amendments.

Jan 16, 2026

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[Free Participation] Solve Manufacturing Site Challenges All at Once! Production Guidance System Webinar

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This is an announcement for a webinar that is a must-see for those considering improving efficiency and stabilizing quality in manufacturing sites. We will be holding the highly praised "Production Guidance System" seminar from IIFES as a special webinar this time. If you have concerns such as: - "I want to eliminate variations in work quality" - "I want to prevent skipping processes and mistakes" - "I want to achieve efficient production even with a labor shortage" this may provide hints for solutions, so we look forward to your registration! 【Date and Time】 February 3, 2026 (Tuesday) 16:00 - 16:40 【Content】 1. Challenges in manufacturing sites and an overview of the guidance system 2. Three features that realize "anyone can do it, without mistakes, efficiently" 3. Case studies of implementation within SANYO Electric 4. Examples of system configuration

Jan 16, 2026

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  • RS 年度末セール 年に1度のスペシャル企画! 期間限定 最大60%OFF 期間:2026 1/5(月)~3/27(金)18:00まで
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