TOMOEGAWA's breathable heater adopted in Nikon's semiconductor exposure equipment - Achieving precise temperature control -
The breathable heater component "iCas MCT," developed by Hakusen Corporation, has been adopted in Nikon Corporation's semiconductor exposure equipment. This equipment is scheduled to be sold starting in December 2026.
Semiconductor exposure equipment requires technology that can form complex and fine electronic circuit patterns on silicon wafers with high precision while also contributing to improvements in productivity and energy efficiency. Even slight temperature fluctuations can affect pattern accuracy, making high-precision and rapid temperature control in the exposure equipment essential, measured in mK (milliKelvin) units.
The breathable heater component "iCas MCT" has been adopted for the first time in semiconductor exposure equipment.
The "iCas MCT" is a heater component that uses a paper-like, porous structure made of "stainless steel fiber sheet" as the heating element. By incorporating breathability into the heater component and allowing air to pass vertically through the heating surface, it effectively heats while minimizing thermal capacity, achieving high temperature responsiveness and heating performance. Additionally, it contributes to the miniaturization and lightweight design of components, as well as the high performance of semiconductor exposure equipment.

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