[Video Release] Cumulative production of 330,000 units! FANUC High-Performance Industrial Robots

Replacing human hands! A compact industrial robot with flexible movements and the ability to "see" and "feel."

The Genkotsu Robot No. 1 is a lightweight, compact high-speed assembly robot. ■ The lightweight and compact mechanism can be easily installed in narrow spaces. It can also be installed at any desired angle. ■ The unique parallel link mechanism enables agile movement. ■ You can choose between no stand, a stand, or an inverted stand. It is easy to integrate into machinery. ■ An iRVision (built-in vision) camera can be integrated into the mechanism. ▼ Three types are available for selection based on your application (see lineup).

• Articulated Robot
• Assembly robot
• Inspection robot

Replacing human hands! A small, high-speed assembly robot with flexible movements and the ability to "see" and "feel"!

The Genkotsu Robot No. 1 (Long Arm Type) is a lightweight and compact high-speed assembly robot. While maintaining the compactness of Genkotsu Robot No. 1, the operating area is 1.5 times larger. It can accommodate wider electronic circuit boards and conveyors. ■ The lightweight and compact mechanism can be easily installed in narrow spaces. Additionally, it can be installed at any angle of inclination. ■ The unique parallel link mechanism enables agile movements. ■ You can choose between no stand, a stand, or an inverted stand. It is easy to integrate into machines. ■ An iRVision (built-in vision) camera can be integrated into the mechanism. ▼ Three types are available to choose from according to your application (see lineup).

• Assembly robot

More extensive than No. 1, faster than No. 3. No. 2 makes its debut with full confidence.

High-speed transport and assembly robot with a movable mass of 3kg, Genkotsu Robot No. 2. This medium-sized machine has been newly added to the Genkotsu Robot series, which previously included the small model No. 1 and the large model No. 3. It features waterproof performance aimed at transport applications in the food and pharmaceutical sectors, along with dramatically improved operational speed. With specifications and performance pursued over time, it is ready to take on the world. 【Features】 - <Approximately twice the operational speed> The lightweight design of the links has improved the operational speed to about twice that of No. 3, making it suitable for a wide range of applications including assembly, transport, and alignment of home appliances and machine parts. - <Excellent waterproof performance> The sealed structure (IP69K) allows it to withstand high-pressure jet cleaning, making it effective for transport applications in the food and pharmaceutical sectors. - <Consideration for food hygiene> Materials, surface treatments, and lubrication that take food hygiene into account can be specified (optional), contributing to automation in the food sector. - <Latest intelligent features> By combining with iRVision (built-in vision) and force sensors, the latest intelligent features can be utilized. ▼ Four types can be selected according to wrist freedom and range of motion (see lineup).

• Articulated Robot
• Assembly robot
• Transport and handling robots

Expanding the application range in logistics and assembly lines with 6 axes! Furthermore, providing strong support on-site with the latest intelligent features!

The Genkotsu Robot No. 3 is a high-speed transport and assembly robot with a portable mass of 6 kg. It features a unique 6-axis type as a parallel link robot, expanding its application range in logistics and assembly lines. ■ With a completely sealed structure, it achieves environmental resistance equivalent to IP67 (dustproof and drip-proof). ■ Materials, surface treatments, and lubrication that consider food hygiene can be specified (optional). This contributes to automation in the food sector. ■ By combining with iRVision (built-in vision) and force sensors, it can utilize the latest intelligent functions. ▼ Three types can be selected according to the application (see lineup).

• Articulated Robot
• Assembly robot
• Transport and handling robots

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)