Notice regarding the launch of a new product for stress measurement devices.

The residual stress measurement device has evolved to this point! We have added the long-awaited compact version, μ-X360s, to the μ-X360 series. It non-destructively measures residual stress, residual austenite, and half-value width in metals and ceramics. It is an excellent device in terms of portability, reliability, safety, operability, and price.
We will be showcasing the actual device at the following exhibition, so please come and visit us.
[Exhibition Information]
Mechanical Elements Technology Exhibition
June 22 (Wednesday) - June 24 (Friday), 2016
10:00 AM - 6:00 PM (until 5:00 PM on the last day)
Tokyo Big Sight, West Hall 4
Booth Number: West 10-31


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This is a link to the release article on our company website.