High Heat Resistant Polycrystalline Mullite Alumina Fiber Fiber Max Board/P Board Series

FiberMax (Alumina Fiber) - High heat-resistant lightweight insulation board that utilizes the properties of PCW (Polycrystalline Fiber).

The FiberMax board series offers a variety of options with maximum usage temperatures ranging from 1400°C to 1800°C. The P board series is a high-temperature lightweight insulation board that utilizes the properties of polycrystalline mullite-based alumina fibers, which have excellent heat resistance and high fiber strength. It has a proven track record in high-temperature processing of various electronic components. ● Please feel free to contact us for product samples.

• Industrial Furnace
• fiber
• Ceramics

High-temperature resistant fiber block product made from laminated compressed PCW (polycrystalline fiber), compliant with RCF regulations.

FiberMax 1600 Uniblock and Saver Block are block-shaped products that are cut (or folded) from PCW (polycrystalline fiber) blankets and unitized while being compressed in layers. We also offer various fittings to suit construction conditions. ● For more details, please contact us or download the catalog.

• Industrial Furnace
• fiber
• Ceramics

Developing products with low shot content! Excellent heat resistance, maintaining high fiber strength even at high temperatures - PCW (polycrystalline fiber) blanket.

FiberMax is a polycrystalline mullite fiber with excellent heat resistance and high fiber strength. The FiberMax 1600SF blanket is a product with an extremely low shot content. It is a product that complies with RCF regulations. ● For more details, please contact us or download the catalog.

• Industrial Furnace
• fiber
• Ceramics

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

By digitizing contract operations, you can reduce many costs, including stamp duty and mailing fees. ◆ Four Benefits of Electronic Contracts - Cost reduction for printing, stamp duty, mailing fees, and original document storage - Improved business efficiency through system-based sending and stamping - Prevention of tampering with timestamps - Enhanced document searchability 【Many Benefits for the Other Party as Well!】 - Both parties can confirm that the document has not been tampered with - No worry about losing the original paper documents - Increased operational efficiency due to the absence of mailing and binding hassles - Quick contract conclusion through email or system verification ◆ Disadvantages of Electronic Contracts - Costs for implementing and operating the service - Need to ensure that business partners understand electronic transactions ----------------------------------------------------- 　　Consult with paperlogic for electronic contract services! -----------------------------------------------------

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.