Contributing to miniaturization through high-density packaging.

We support the implementation of small chip components essential for miniaturizing substrates and their narrow gap mounting.
Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology.
We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones.
Additionally, we are capable of accommodating even smaller components, such as 0201 and 03015 sizes.
【Features】
- Implementation of 0402 size components with narrow gap
- Mixed mounting with large components (connectors, etc.) is possible
- Capable of implementing 0201 and 03015 size components
- Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality.

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