Notice of Participation in the International Logistics Comprehensive Exhibition 2021 (October 13-15, Tokyo Big Sight)

A warehouse suitable for confectionery set work and apparel inbound/outbound and inspection work. Since it is located near the Seino Transportation facility and truck terminal, it enables the establishment of an optimal delivery network.

The Hakuryu Distribution Center employs centralized air conditioning management and is equipped with clean room functions. It allows for logistics outsourcing from the manufacturing process, particularly achieving improvements in food processing quality and cost reduction. Features of the logistics center: - It is a center equipped with air conditioning in all rooms and capable of handling distribution processing with clean rooms. - Being a high-floor facility, it is easy to manage inbound and outbound logistics. The high floor design allows for direct transfer from containers and trucks to forklifts, making it less susceptible to dust and other contaminants.

• Other contract services

Automatically create loading plans that minimize dead space. Presentation of materials introducing features and improvement examples. Trial version available.

"Banning Master" is a system that visualizes cargo based on size information and creates loading plans considering weight balance, constraints, and workability. It optimizes loading efficiency for containers, trucks, pallets, etc., and can flexibly respond to additional or canceled cargo. It can also be used for continuous improvement of loading efficiency by identifying bottlenecks. We offer a "software version" that can be customized to fit your business needs, as well as a "cloud version" that requires no installation. 【Features】 ■ Automatically calculates and visualizes highly efficient loading plans ■ Properly calculates the center of gravity, preventing cargo shifts and contributing to improved transport quality ■ Many successful implementations in automotive parts, electronics, food, and building materials manufacturers ■ Capable of providing algorithms that consider loading rules ★ We are currently offering materials that include examples of improvements in import and export of products. You can view them immediately via "PDF Download." * A trial version of the cloud version (10 days) is also available. Please contact us for more details.

• Other operation management software

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)