Innodisk's innovative lineup for industrial applications.

Embedded DRAM module - Achieved a 11.2% increase in transfer speed compared to conventional products.

For more details, please refer to the PDF document or feel free to contact us. The "DDR4 2666MT/s series" is a DRAM module designed for embedded applications. We also offer DIMMs for server applications, achieving an 11.2% increase in transfer speed compared to the current 2400MT/s series. We ensure high reliability by implementing genuine DRAM, fixed BOM, and our own shipping inspection, which are required for embedded applications. <Features> - Designed for embedded applications - 11.2% increase in transfer speed compared to the current 2400MT/s series - Implementation of genuine DRAM, fixed BOM, and our own shipping inspection - High reliability

• Other electronic parts
• Other semiconductors
• Memory

DDR4 3200MT/s Series

For more details, please refer to the PDF document or feel free to contact us. [Product Lineup] ● UDIMM ● SODIMM ● RDIMM ● RDIMM VLP ● ECC DIMM ● Temperature-Extended Products We offer a wide range from 2GB to 32GB. Innodisk's DDR4 3200MT/s memory modules for industrial equipment include Unbuffered modules, temperature-extended products (-40~85℃), and low-profile products (VLP). We also provide ECC DIMM and RDIMM for server applications. All products undergo component fixation and are tested before shipment to ensure high reliability necessary for the stable operation of your equipment. We offer products that can be used with confidence alongside Innodisk's flash storage.

• Memory

Innodisk next-generation 3D NAND equipped SATA SSD solution! SATA 3TE7 / 3TG6-P series

For more details, please refer to the PDF document or feel free to contact us. Innodisk specializes in industrial and embedded SSDs equipped with 3D NAND, achieving long lifespan, high reliability, and high performance through its own developed firmware. We offer two models: one with DRAM cache and one without. ◇ SATA 3TE7 Series (Model without DRAM cache) ◇ SATA 3TG6-P Series (Model with DRAM cache) Additionally, we have a diverse lineup available, including mSATA, SATA slim, SSD, Cfast, M.2, and DRAM products, among others.

• Other electronic parts
• Other semiconductors
• SSD

World's smallest industrial-grade SSD, further enhanced with PCIe Gen. 3x2.

For more details, please refer to the PDF materials or feel free to contact us. Innodisk's nanoSSD PCIe 3TE7 (µSSD) series brings astonishing performance to the world's smallest SSD form factor. ◇ World’s first, world’s smallest: The industry's first PCIe Gen. 3x2 nanoSSD (µSSD) stored in a PCI-SIG standard M.2 Type 1113 BGA. ◇ Incredible speed: Remarkable performance through the PCIe Gen. 3x2 interface. ◇ Security first: Enhanced by hardware-based AES-256 and TCG Opal 2.0 compliance. ◇ Data integrity: LDPC ECC engine and end-to-end data path protection (ETEP). ◇ Thorough robustness: Manufactured using temperature-expanded wafers to eliminate mechanical interference.

• SSD

96-layer 3D NAND storage optimized for industrial use & 4-port CAN Bus innovation

For more details, please refer to the PDF document or feel free to contact us. Introducing Innodisk's industrial-grade innovations in the field of flash storage and CAN bus expansion. <Solutions for Next-Generation Computing> Innodisk has solidified its position at the forefront of industrial-grade innovation with new products optimized for industrial and semi-industrial use. This includes the latest series of 96-layer 3D NAND flash storage products, which combine the high capacity and low cost of 96-layer 3D NAND with Innodisk's industrial-grade technology. Additionally, the 4-port CAN bus module can execute next-generation control functions across a variety of applications.

• SSD

4GB high-capacity flash storage for applications that demand top performance and unparalleled security.

For more details, please refer to the PDF document or feel free to contact us. By combining new flash storage technology with Innodisk's security features and signature ruggedness, we achieve high-performance packages that can be used immediately in various applications.

• SSD

Monitoring via the cloud! SSD monitoring platform!

'iCAP' is an SSD monitoring platform that allows you to monitor the SMART information of SSDs installed in devices located in multiple remote locations via the cloud. You can choose from two server sites for the cloud based on your environment. It can monitor the status of solid-state drives (SSDs), memory, and other components of edge devices. 【Features】 ■ Seamless integration of unsupported devices ■ Smooth and efficient deployment ■ Quick access from anywhere with an internet connection ■ Event notification tracker logs all changes, maintaining user speed ■ Backup and recovery of remotely initialized systems *For more details, please refer to the PDF materials or feel free to contact us. We also offer a diverse lineup of products, including mSATA, SATA slim, SSD, Cfast, M.2, etc.

• Other electronic parts
• Other security and surveillance systems
• SSD

No internet connection is required, and expensive software is not needed. High levels of expertise are also not necessary.

For more details, please refer to the PDF document or feel free to contact us. Innodisk's unique InnoOSR series features patented firmware technology that simplifies recovery tasks. InnoOSR is available in major form factors.

• Memory

[White Paper] iSLC: Position in the High-End Market

For more details, please refer to the PDF document or feel free to contact us. Firmware technology is built on a framework of MLC NAND flash. MLC NAND flash cells are designed to hold 1 bit per cell and operate at SLC NAND flash levels. iSLC is a hybrid of MLC and SLC technology, offering performance close to SLC while significantly improving durability. The price range is between MLC products and SLC products.

• Memory

Protect the SSD and prevent power instability from affecting the system.

For more details, please refer to the PDF document or feel free to contact us. Innodisk offers the "iPower Guard Technology." In many cases, the power environment for remote applications is not stable. This can lead to system crashes during booting and shutting down, potentially damaging the SSD. This product is a technology designed to protect the SSD and prevent the instability of the power supply from affecting the system.

• Other operation management software

Fix unexpected SSD errors and maintain smooth operation even in harsh environments.

For more details, please refer to the PDF document or feel free to contact us. Innodisk provides "end-to-end data path protection." This is a method to ensure data integrity at various stages from the moment data is transmitted from the host to the SSD. ETEP uses error correction code (ECC) to safely protect data at various data transfer points.

• Document and Data Management

Introduction to the Innodisk Embedded Standard Module Series

For more details, please refer to the PDF document or feel free to contact us. Innodisk's memory modules for industrial equipment include a lineup of standard SDRAM and DDR4 Unbuffered modules, as well as temperature-extended products (-40 to 85°C) and low-profile products (VLP). We offer ECC DIMMs and RDIMMs for server applications. - All products have fixed components - All units undergo pre-shipment testing We ensure high reliability necessary for the stable operation of your equipment. We provide products that can be used with confidence alongside Innodisk's flash storage. ◇ Solutions for achieving high reliability (optional) - Side Fill Doubles the delamination resistance of DRAM ICs. - Conformal Coating Coated with HumiSeal resin. Prevents failures due to water, rust, and acidic substances. - Anti-Sulfuration Protects DRIMM from sulfide substances caused by air pollution.

• Memory
• Memory

[White Paper] ECC DRAM Modules Utilizing Hamming Code - Ideal for Applications Requiring High Reliability and Stability

For more details, please refer to the PDF document or feel free to contact us. Computer crashes and software malfunctions caused by data errors are serious issues.

• Memory

Simple yet robust technology that reduces stress on DRAM modules.

For more details, please refer to the PDF document or feel free to contact us. This white paper aims to explain the challenges faced by the embedded industry in harsh environments and why side-fill is the optimal solution.

• Memory

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)