[New Technology Information] Development of High-Frequency High Heat Dissipation Substrates Using High-Speed Thick Copper Plating Method
We have developed a substrate suitable for heat dissipation measures for high heat dissipation components such as power semiconductors, using our unique high-speed thick copper plating technology.
This product allows for flexible design in terms of shape and size due to the use of thick copper plating, and it can accommodate thin plate structures of less than 0.4mm for power semiconductors, which was difficult with conventional aluminum substrates, copper base substrates, and the recent trend of copper inlay substrates, as well as build-up layer configurations.

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