VCXO 3.2×2.5mm (Voltage Controlled Crystal Oscillator) (CEC Panda Corporation)

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We handle the 3.2×2.5mm SMD voltage-controlled crystal oscillator manufactured by CEC Panda. If you are looking for new suppliers, please feel free to contact us. ■ Reference page in the catalog: 3.2j 2.5 SMD VCXO General p34 * You can download the catalog available in both English and Chinese. * For more details, please refer to the PDF document or feel free to contact us.

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The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)