[Magazine Contribution] Featured in the March issue of Press Technology: "Fundamental Knowledge of Workpieces Necessary for Press Forming Simulation"

Digital integration of the press forming and body-in-white (BiW) assembly process chain.

The AutoForm software solution for Body-in-White (BiW) assembly supports the entire BiW process chain, from early feasibility to process engineering and even BiW production. 【Features】 - Evaluation and improvement of assembly processes at an early stage - Improvement of assembly accuracy through part identification and anticipated corrections - Effective corrective strategies for process improvement - Identification of assembly defects before production begins *For more details, please refer to the "Catalog Download." Feel free to contact us with any inquiries.

• 3D CAD
• simulator
• Software (middle, driver, security, etc.)

Introducing different approaches aimed at achieving assembly results in press forming engineering!

We will demonstrate, using practical examples, how considering the results of the hemming process in advance during the design of the press forming process can minimize the risk of costly redesigns by incorporating those results into the design. [Contents] - Press forming process considering hemming results - Comparison of individual part springback and subassembly springback - Results of process verification *For more details, please refer to the "Catalog Download." Feel free to contact us with any inquiries.

• 3D CAD
• simulator
• Software (middle, driver, security, etc.)

By realizing a digital twin of the press molding process, we significantly reduce mold trial and production downtime! We are also offering materials that showcase application examples!

We are pleased to present a white paper on the "AutoForm REM Package," which combines software modules for press forming, training, and consulting services to realize a digital twin of the press forming process. [Contents of the White Paper] ■ What is a Robust Engineered Model (REM)? ■ What is the AutoForm REM Package? ■ Benefits of the AutoForm REM Package ■ Seamless digitization of the entire press forming process ■ AutoForm Accuracy Indicators ■ Introduction of application examples *If you would like a copy of the white paper, please request a catalog through "Contact Us" or view it as a PDF from "PDF Download."

• others

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)