It is a combustion-type exhaust gas treatment device.
This device processes exhaust gases such as hydrogen compounds like SiH4, and fluorinated compounds like C2F6 and SF6, which are emitted by semiconductor manufacturing equipment, by utilizing the thermal exhaust from a combustion burner for thermal decomposition. Additionally, the products generated after thermal decomposition (such as SiO2 powder and acidic gases) are further processed in a wet scrubber within the same package. 【Features】 - By separating the combustion nozzle and the secondary combustion chamber, stable combustion is possible during flow rate fluctuations. - It can handle exhaust gases with a maximum processing flow rate of 500 L/min (capable of supporting up to 4 ports). - Wall air prevents the adhesion of by-products inside the combustion chamber. - The adoption of a direct cooling method using water spray immediately after the combustion tube has achieved space-saving design. - Continuous stirring of the circulating water in the wet scrubber tank prevents circulation pump troubles caused by SiO2 powder slurry. - Equipped with various sensors, ensuring comprehensive safety measures. - The touch panel allows for easy operation and monitoring of the operating status. *For more details, please refer to the PDF materials or feel free to contact us.*
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