Achieving ultra-fast structural analysis of large-scale models exceeding tens of millions to one hundred million degrees of freedom.
ADVENTURECluster performs calculations that would typically take an enormous amount of time with general-purpose FEM codes, such as those involving entire automotive engines or large assembly models with many contact conditions, at unprecedented speeds. With a comprehensive menu structure and detailed supplementary explanations unique to domestic products, along with a user-friendly Japanese GUI and attentive technical support, engineers can use it comfortably and with confidence. Additionally, it supports a wide range of coupled analyses with other software.
Inquire About This Product
basic information
◆ A "purely domestic" structural analysis tool commercialized based on the research results of the Japan Society for the Promotion of Science's large-scale computational mechanics system development project (ADVENTURE project). ◆ Composed of a unique pre-solver-post structure, each module is specialized for large-scale processing, and the solver achieves a reduction in computation time through a proprietary algorithm called the CGCG method (Patent No. 3824582), which combines domain decomposition and iterative methods. ◆ Supports a wide range of analyses: - Static elastic analysis - Elastic-plastic analysis - Vibration analysis (eigenvalues, frequency response) - Contact analysis - Heat conduction analysis (steady-state, unsteady-state) - Dynamic analysis (negative, positive) - Fatigue analysis (stress-based) - Creep analysis - Crack propagation analysis - Lead-free solder analysis (RDNLK/velocity-dependent nonlinear hardening law) - Fracture mechanics parameters (stress integral, J-integral) <Various materials and catalogs> If you would like any necessary materials or case studies, please request them through the inquiry form.
Price information
For detailed pricing information, please feel free to contact us.
Delivery Time
Applications/Examples of results
◆Applications - Static elastic analysis, elasto-plastic analysis, vibration analysis (eigenvalues, frequency response), contact analysis, thermal conduction analysis (steady-state, unsteady-state) - Dynamic analysis (negative, positive), fatigue analysis (stress-based), creep analysis, crack propagation analysis - Lead-free solder analysis (RDNLK/velocity-dependent nonlinear hardening rule) - Fracture mechanics parameters (stress integral, J-integral), etc. ◆Achievements - Thermal stress analysis of assembly engine models, strength analysis of cylinder blocks, stress analysis of press part molds - Stress analysis of resin part molds, stress analysis of die-casting molds, etc. For more details on applications and achievements, please contact us.
catalog（3）
Download All Catalogs
Company information
We provide SCSK's cutting-edge solutions best suited for manufacturing, including design and visualization, pre- and post-processing, CAE analysis, production technology analysis, material development solutions, MI, AI predictive modeling, optimization, PLM, and cost management.
![[Column] The Theory of OPTISHAPE-TS: Checkerboard Phenomenon](https://image.mono.ipros.com/public/product/image/b70/2000845506/IPROS38697816703090052483.png?w=280&h=280)
