Sintered diamond mold components
Sintered diamond mold components with 124 times the wear resistance of cemented carbide, widely used as materials for wear-resistant tools. ■□■ Features ■□■ ■ While maintaining the high hardness characteristic of diamond, it offers high freedom in size and shape. ■ Physical properties of sintered diamond: - Vickers hardness (HV/GPa) Sintered diamond: 78.4 to 117.6, Cemented carbide: 11.8 to 17.6 - Fracture toughness (KIC/MPa·m^1/2) Sintered diamond: 8.8, Cemented carbide: 8.5 to 12 - Flexural strength (σm/GPa) Sintered diamond: 1.0 to 2.0, Cemented carbide: 2.0 to 3.0 - Young's modulus (E/GPa) Sintered diamond: 88 to 98, Cemented carbide: 54 to 59 - Coefficient of dynamic friction (μ) Sintered diamond: 0.05, Cemented carbide: 0.2 to 0.3 - Coefficient of thermal expansion (α/10^-6K^-1) Sintered diamond: 3.1, Cemented carbide: 4.8 to 5.3 ■ If you feel limited by the wear resistance of cemented carbide materials, please consider this option. For more details, please contact us.
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basic information
Sintered diamond mold components with 124 times the wear resistance of cemented carbide, widely used as materials for wear-resistant tools. ■□■ Features ■□■ ■ While maintaining the high hardness characteristic of diamond, it offers high freedom in size and shape. ■ Physical properties of sintered diamond: - Vickers hardness (HV/GPa) Sintered diamond: 78.4 to 117.6, Cemented carbide: 11.8 to 17.6 - Fracture toughness (KIC/MPa·m^1/2) Sintered diamond: 8.8, Cemented carbide: 8.5 to 12 - Flexural strength (σm/GPa) Sintered diamond: 1.0 to 2.0, Cemented carbide: 2.0 to 3.0 - Young's modulus (E/GPa) Sintered diamond: 88 to 98, Cemented carbide: 54 to 59 - Coefficient of dynamic friction (μ) Sintered diamond: 0.05, Cemented carbide: 0.2 to 0.3 - Coefficient of thermal expansion (α/10−6K−1) Sintered diamond: 3.1, Cemented carbide: 4.8 to 5.3 ■ If you feel limited by the wear resistance of cemented carbide materials, please consider trying this. For more details, please contact us.
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Applications/Examples of results
■□■ Processing Examples ■□■ Heater plates, gates, cut forming punches, round gates, round punches, dies, pressure pads, punching molds, die blocks, lead holders, wedges, rivets, semiconductor mount nozzles.
Company information
Simply having a low price or a short delivery time does not differentiate us from other companies, so we work with your representatives to achieve total cost performance through meetings and proposals. There are various types of surface treatment (surface modification). If you consult with us, we can suggest the best type of film if you let us know about any issues or your current situation. Please feel free to reach out if you have any concerns regarding mold lifespan or process defects.