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  6. Small-scale trial (even 1 unit is OK) and we have numerous implementation achievements with PET.

Small-scale trial (even 1 unit is OK) and we have numerous implementation achievements with PET.

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last updated:Nov 11, 2020

三重電子
三重電子
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Implementation using anisotropic conductive film (ACF)

Implementation using anisotropic conductive film (ACF) 【Features】 ○ A film molded from a thermosetting resin mixed with fine conductive metal particles ○ Conductivity is maintained in the vertical direction, while insulation is preserved in the horizontal direction, forming anisotropy ○ When sandwiched between electrodes and subjected to heat and pressure, pressure is applied only to the film area in contact with the electrodes, causing the dispersed particles within the film to be pressed together, allowing the plating layers of the ACF particles to bond together and conduct electricity ● For more details, please contact us or download the catalog.

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Small-scale trial (even 1 unit is OK) and we have numerous implementation achievements with PET.

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Implementation using anisotropic conductive film (ACF) 【Features】 ○ A film formed by mixing conductive fine metal particles with a thermosetting resin and shaping it into a film ○ Conductivity is maintained in the vertical direction, while insulation is maintained in the horizontal direction, creating anisotropy ○ When sandwiched between electrodes and subjected to heat and pressure, pressure is applied only to the film area where the electrodes touch, causing the particles dispersed within the film to be pressed together, resulting in the conductive layers of ACF particles sticking to each other ● For more details, please contact us or download the catalog.

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Applications/Examples of results

●COF (Mounting IC chips on flexible substrates) ●FOG (Mounting flexible substrates on glass substrates) ●COG (Mounting IC chips on glass substrates) ●FOB (Mounting flexible substrates on rigid substrates) ●FOF (Mounting flexible substrates to each other) ●FOP (Mounting flexible substrates on film substrates (PET))

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三重電子

三重電子

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We undertake various implementations related to flat panel displays (LCD, organic EL, etc.) such as COF, flip chip, COG, TAB, and heat seal. In particular, we also handle small lot implementations during the research and development and prototyping stages, which can be helpful for our customers facing challenges in their research and development phases. We accept custom design and manufacturing of TN and STN specification custom LCD modules for industrial applications such as measuring instruments and medical devices, starting from small lots (1K) to custom-made solutions. Our production equipment primarily includes ACF bonding machines, and we offer semi-automatic machines. There are advantages to using them offline for research and development, prototyping, and repair purposes.

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