It is based on alumina, has strong adhesion, and is suitable for bonding ceramics and steel.
High-temperature ceramic adhesive made by Alemco, alumina-based. It is used for assembling and bonding high-temperature thermocouple cases used in heating furnaces and boilers. Other applications include assembly, insulation for high-temperature sensors, instrumentation, and use in thermal resistance elements. It is a one-component, water-soluble adhesive that also functions as a coating agent. The heat resistance limit is 1,760°C.
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■Main Features - Maximum heat resistance is 1760°C - Ideal for assembly, insulation of high-temperature sensors, instrumentation, and use in thermal resistance elements - A one-component, water-soluble adhesive based on aluminum oxide that also functions as a coating agent - Excellent mechanical and electrical properties ■Physical Properties - Strength: 24.0 ft-lbs - Insulation: 182 volts per mil (at room temperature) - Coefficient of thermal expansion: 7.7×10^-6 in/in/°C - Suitable for use on substrates including ceramics, steel, and non-ceramics such as stainless steel - Can be easily applied using a brush or dispenser - Can be cleanly removed with warm water and soap before curing ■For more details, please contact us.
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■Main Uses - Assembly and bonding of high-temperature thermocouple cases used in heating furnaces and boilers - Suitable for assembly, insulation of high-temperature sensors, instrumentation, and use in thermal resistance elements - Suitable for use on substrates including ceramics, steel, stainless steel, and non-ceramics
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Audeck Co., Ltd. was established on June 28, 1973, with the aim of importing, manufacturing, and selling industrial chemical products. In November 1988, the company partnered with the American heat-resistant adhesive manufacturer, Alembic Products, to sell their ceramic and heat-resistant epoxy adhesives and ceramic coatings in Japan. In the late 1980s, the company began selling heated black dye, and after 1986, developed new heated black dyeing equipment. Furthermore, in 2003, they launched an electroless nickel plating device, continuing to grow steadily.