Ideal for releasing thermosetting resins such as phenolic and epoxy resins.
Tephylis is a release agent that adds a heat-resistant binder to fine particles of fluororesin, creating a dry lubricating film of several microns on the surface of molds through application or spraying. It contains no silicone at all. Secondary processing can be done immediately after molding. The heat resistance temperature is 250°C, making it ideal for the release of thermosetting resins such as phenolic resins that are molded at high temperatures. 【Capacity: 420ml aerosol can】
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basic information
■□■Features■□■ ■Heat resistance temperature: -196℃ to 250℃ ■Can be released continuously with a single application or spray ■Release occurs at the interface, with minimal transfer to the molded product, allowing for secondary processing such as plating, printing, painting, and bonding without issues, and the cleaning process can be omitted ■The lubricating film is thin and non-liquid, preventing accumulation in localized areas, enhancing the dimensional accuracy of the molded product and reducing the defect rate ■Reduced contamination of molds, leading to potential cost savings in maintenance
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Applications/Examples of results
- For the release of engineering plastics with high molding temperatures - As a release agent for plastic molding when the mold shape is complex and precision is required - For the release of diamond tools - For the release of FRP - For the release of rubber - As a lubricant for bearings, conveyors, and chutes There are various other applications as well.
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Audeck Co., Ltd. was established on June 28, 1973, with the aim of importing, manufacturing, and selling industrial chemical products. In November 1988, the company partnered with the American heat-resistant adhesive manufacturer, Alembic Products, to sell their ceramic and heat-resistant epoxy adhesives and ceramic coatings in Japan. In the late 1980s, the company began selling heated black dye, and after 1986, developed new heated black dyeing equipment. Furthermore, in 2003, they launched an electroless nickel plating device, continuing to grow steadily.