High-precision automatic temporary bonding device capable of correcting and bonding coverlay film expansion.
It is a device for temporarily attaching difficult-to-handle coverlay films to printed circuit boards and the like.
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basic information
Automatic temporary attachment device for coverlay film to be applied to FPCB with high precision. 【Features】 ○ Quality improvement, cost reduction ○ Labor saving ○ Easy operation and accurate installation settings via personal computer ○ Roll-to-roll compatibility ○ Temporary attachment capable of correcting the expansion and contraction of coverlay film ○ Machine size: 1830 (W) × 1610 (D) × 2000 (H) ○ Effective width: 250mm ○ Power supply: 3φ 220V 15kW ■ For other functions and details, please contact us or download the catalog. (Contact: Kawaguchi)
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The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.