Leave it to us when it comes to double-sided grinding machines.
We have received high praise from customers in various fields for our grinding, polishing, cutting, and have developed technologies related to fine grinding, wrapping and polishing equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid trust.
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【Features】 - Simultaneous grinding (polishing) on both sides with two upper and lower grinding stones. - 5 to 10 times higher processing efficiency compared to conventional lapping methods. - High-precision parallel planes are achieved through the planetary motion of the workpiece. Please contact us regarding cutting machines and polishing machines.
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We have received high praise from customers in various fields for our grinding, polishing, and cutting technologies. We have developed technologies related to fine grinding, wrapping and polishing equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid reputation for reliability. Moving forward, we aim to propose even better products and contribute to society in various ways.