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We have received high evaluations from customers in various fields for our grinding, polishing, cutting, and other technologies. We have developed technologies for flying line grinding, wrapping and polishing related equipment, semiconductor-related products, dicing machines, and back grinding machines, and have consistently provided products based on solid trust.
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basic information
【Features】 - Compatible with mirror polishing of sapphire/SiC wafers - The facing mechanism allows for easy flat correction of the reference plate - Can accommodate wafers up to 6 inches Please contact us regarding cutting and polishing machines.
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Facing Single-Sided Grinding Machine ASL-1000F This is an internal photo of the Facing Single-Sided Grinding Machine ASL-1000F. Please contact us if you are interested. tel: 042-705-7011 2165-1 Tana, Chuo-ku, Sagamihara City, Kanagawa Prefecture
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We have received high praise from customers in various fields for our grinding, polishing, and cutting technologies. We have developed technologies related to fine grinding, wrapping and polishing equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid reputation for reliability. Moving forward, we aim to propose even better products and contribute to society in various ways.