Leave it to us for double-sided grinding machines, polishing machines, and CMP equipment.
We have received high praise from customers in various fields for our grinding, polishing, cutting, and have developed technologies for flying line grinding, wrapping and polishing related equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid foundation of trust.
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【Features】 - Compact CMP device for R&D, platen φ400, compatible with 4 and 6-inch wafers - Achieves stable processing reproducibility and reduced maintenance costs - Models compatible with 6 to 12 inches are also available Please contact us regarding cutting and polishing machines.
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This is an internal photo of the CMP device POLI-400.
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We have received high praise from customers in various fields for our grinding, polishing, and cutting technologies. We have developed technologies related to fine grinding, wrapping and polishing equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid reputation for reliability. Moving forward, we aim to propose even better products and contribute to society in various ways.