Process brittle materials with a hard and fragile substrate to make them thinner, reducing damage from processing changes, and enabling grinding to the thinness of the polishing processing area!
The vertical surface grinder SGM-8000 is a device designed for easily and quickly grinding hard materials (such as sapphire, SiC, GaN, etc.) with high precision.
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basic information
【Features】 ○ Oscillation mechanism ○ Overload detection system ○ Intermittent feeding system ○ Zero-touch system ○ Oscillation ○ Automatic measurement system ● For other functions and details, please contact us.
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Applications/Examples of results
【Application】 ○ The vertical surface grinding machine SGM-8000 is a device designed for easily and quickly grinding hard materials (such as sapphire, SiC, GaN, etc.) with high precision. ○ The grinding wheel spindle and workpiece spindle are arranged vertically, with each spindle rotating, allowing the grinding wheel spindle to feed towards the workpiece spindle for grinding. ○ The grinding wheel spindle swings back and forth (new mechanism), enabling thin and low-damage grinding of brittle material substrates. ○ With a maximum processing diameter of Φ300, it allows for batch processing and has high productivity. ● For other functions and details, please contact us.
Company information
As a manufacturer of horizontal surface grinding machines, high-speed precision grinding machines, diamond slurry, and bonding machines, we provide not only the technology to make various substrate materials required by customers in advanced technologies such as semiconductors and optical communications "thinner," but also processing know-how to solve our customers' problems.
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