Ideal for fragile substrates! Achieves low-damage backlighting for sapphire, GaAs, SiC, and silicon wafers!
The horizontal flat grinding device SGM-7000 is the ideal equipment for thinly grinding brittle material substrates.
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basic information
【Features】 ○ New oscillation mechanism ○ Intermittent feeding system ○ Overload detection system ○ Zero-touch system ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Purpose】 ○ The horizontal surface grinding machine SGM-7000 is the ideal device for thinly grinding brittle material substrates, etc. ○ It allows for gentle grinding with minimal damage to the workpiece, enabling processing that reaches the thickness of the polishing area. ○ Grinding processes that used to take a long time can now be completed in a short period, significantly improving yield. ● For other functions and details, please contact us.
Company information
As a manufacturer of horizontal surface grinding machines, high-speed precision grinding machines, diamond slurry, and bonding machines, we provide not only the technology to make various substrate materials required by customers in advanced technologies such as semiconductors and optical communications "thinner," but also processing know-how to solve our customers' problems.
![[Research Material] Global Market for Wafer Grinding Equipment](https://image.mono.ipros.com/public/product/image/969/2001474143/IPROS05323631312017536240.jpeg?w=280&h=280)
