There is no common issue of "flatness deviation of the reference plate" found in grinding machine manufacturers, and the workpiece can always be ensured to be flat without the need for flat grinding technology, making it easy for anyone to secure flatness!
Brittle material substrates (such as sapphire, SiC, GaN, etc.) can be easily polished to a high precision flat surface in a short time.
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basic information
【Features】 ○ Swing of the upper bearing, drive mechanism ○ Forced feeding mechanism ○ Overload detection system ○ Zero-touch system ○ Intermittent feeding system ○ Workpiece dimension management ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Purpose】 ○ Frees operators from the flatness management of the reference plate that has been a concern in the organization, allowing for polishing production while maintaining stable flatness. ○ The maximum processing diameter is Φ250, enabling batch processing and high productivity. ● For other functions and details, please contact us.
Company information
As a manufacturer of horizontal surface grinding machines, high-speed precision grinding machines, diamond slurry, and bonding machines, we provide not only the technology to make various substrate materials required by customers in advanced technologies such as semiconductors and optical communications "thinner," but also processing know-how to solve our customers' problems.