This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.
Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.
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basic information
【Features】 ○ Excellent thermal conductivity ○ Industry's highest dielectric breakdown voltage ○ Lower dielectric constant compared to epoxy resin substrates ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ High-brightness LED mounting boards ○ Automotive boards ○ Boards requiring high heat dissipation characteristics ○ Various inverter boards ○ Various motor driver boards ○ High-frequency boards ● For other functions and details, please contact us.
Company information
Products created from Meito Electric's technology, which seeks higher precision, contribute to safety and comfort. If you have any questions about printed circuit boards or electrical insulation materials, please feel free to consult us.
