Thermosetting resin-containing flux
The strength is improved by about 1.5 times by reinforcing the ball with flux residue.
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basic information
【Features】 ○ Wettability: Has the same activity as general-purpose flux, allowing soldering from microballs. ○ No-clean flux residue: The flux residue has excellent adhesion to underfills, enabling no-cleaning of residues after flip chip mounting. ○ Curing properties: The curing of the flux residue reinforces the solder joints and improves joint reliability. ● For more details, please refer to the catalog or contact us.
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Company information
**Environmental Philosophy** Our company recognizes that the preservation of the global environment is a crucial mission shared by all humanity. Under this mission, we will do our utmost to contribute to the formation of a circular society by harmonizing nature with our business activities and leaving a rich Earth for future generations. **Environmental Policy** 1. We will comply with environmental-related laws and regulations and strive to achieve self-imposed management standards as necessary. We will also adhere to commitments made in environmental agreements with local communities. 2. We will establish the following key themes, which have a significant impact on the environment, as priorities in our business activities: 1) Promotion of energy conservation and resource saving 2) Reduction of waste emissions 3) Reduction of the use of specified chemical substances 3. We will promote environmental management activities based on ISO 14001, focusing on continuous improvement and pollution prevention. 4. We will communicate with the local community and cooperate in creating towns that are friendly to both people and nature. 5. We will set environmental objectives and targets and review them as necessary.