Semiconductor Paste BPS Series
M705-BPS is a lead-free solder paste developed for fine bump formation. It demonstrates good printability and stencil release at fine pitch, ensuring a stable amount of solder. Additionally, there are no occurrences of voids within the bumps.
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basic information
【Features】 ○ Demonstrates good printability and plate release in fine pitch, with no occurrence of voids within bumps. ○ Ensures high reflow capability, suppressing the decrease in wettability, solder balls, and the occurrence of voids within bumps. ○ Minimal slumping due to heating, suppressing the occurrence of bridging after reflow. ○ Good cleanability against various cleaning agents. ● For more details, please refer to the catalog or contact us.
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Company information
**Environmental Philosophy** Our company recognizes that the preservation of the global environment is a crucial mission shared by all humanity. Under this mission, we will do our utmost to contribute to the formation of a circular society by harmonizing nature with our business activities and leaving a rich Earth for future generations. **Environmental Policy** 1. We will comply with environmental-related laws and regulations and strive to achieve self-imposed management standards as necessary. We will also adhere to commitments made in environmental agreements with local communities. 2. We will establish the following key themes, which have a significant impact on the environment, as priorities in our business activities: 1) Promotion of energy conservation and resource saving 2) Reduction of waste emissions 3) Reduction of the use of specified chemical substances 3. We will promote environmental management activities based on ISO 14001, focusing on continuous improvement and pollution prevention. 4. We will communicate with the local community and cooperate in creating towns that are friendly to both people and nature. 5. We will set environmental objectives and targets and review them as necessary.