MEMS Stress Observation Device IRSM-001
This device is capable of visualizing the stress distribution (thermal elastic stress) of MEMS products, which could only be analyzed using CAE in the past, in a non-contact manner and in a short time.
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basic information
【Features】 ○ Non-contact stress analysis device for MEMS using infrared camera ○ Clarification of failure causes through detection of stress distribution and stress concentration areas ○ Prediction of fatigue failure occurring in stress concentration areas and construction of strength design data ○ Equipped with various vibration modes ○ Stress measurement on the order of 1 MPa (during lock-in analysis) ● For other functions and details, please refer to the catalog.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Gyroscope ○ Accelerometer ○ Inkjet nozzle ○ Pressure sensor ● For other functions and details, please refer to the catalog.
Company information
To solve your technical challenges in a ONE-STOP manner, our team of 1,300 technical specialists will respond quickly and accurately while maintaining strict confidentiality. With bases in six locations nationwide, our experts in various fields utilize the latest analytical testing equipment to meet all your needs. We are confident that we can provide results that will satisfy you, and we would be grateful if you could give us a try.
