It is a circuit formation method using hot stamping.
It is a type of MID (Molded Interconnect Device), a method of forming circuits on resin molded products without using plating. Development and sales related to IVONDING are conducted by Osaka Vacuum Chemical Co., Ltd., the general agent for Japan and the Asian region.
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basic information
【Features】 ○ Directly routes wiring onto thermoplastic resin using a hot stamp method ○ Eliminates the need for wastewater treatment such as plating ○ Environmentally friendly method for producing MID (Molded Interconnect Devices) ○ Capable of processing all types of thermoplastic resins ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○Automotive ○Mobile phones ○Meters ●For other functions and details, please contact us.
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Company information
We are a comprehensive surface treatment company that provides various parts by processing various materials in various ways.