Heat-activated peeling type thermal foam adhesive film
The Somatack TE series offers a variety of types with different foaming temperatures and release forces.
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basic information
【Features】 ○ Strong release force before foaming (improves workability) ○ Easy to peel off after heating ○ Thin foam layer allows for quick heat conduction, enabling shorter processing time ○ Can be bonded on both sides ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○Heat resistance temperature: 100℃ ○Thickness of heat-foamed adhesive layer: 37μm ○Probe tack: 1.6 ●For other functions and details, please contact us.
Company information
Somar aims for next-generation technology with its unique formulation and coating techniques based on molecular-level material design.