Confident in various applications, as well as invasiveness and moisture resistance!
The Somatect KZ series is a thermosetting resin for semiconductor encapsulation. We offer a variety of applications, including grab-top resin, underfill resin, and CSP reinforcement resin.
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basic information
【Features】 ○ Excellent workability with a one-component system and outstanding storage stability ○ Grab-top resin with various grades prepared to match fluidity, substrate, and other applications ○ Underfill resin with excellent penetration and moisture resistance ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Grab top resin ○ Underfill materials ○ Underfill materials for BGA and CSP ○ Resin for CSP reinforcement, excellent low-temperature curing (80℃) and repairability (KZ-107-4), also available in high-reliability types for automotive substrates ● For other functions and details, please contact us.
Company information
Somar aims for next-generation technology with its unique formulation and coating techniques based on molecular-level material design.
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