Nano Incoater (Release Agent Coating Device) NIC-1103
Release Type Processing Device (Nano Coater: NIC-1103)
8-inch wafer compatible nano coater (release agent application device)
This device is designed to apply a release agent to a maximum 8-inch wafer through the processes of coating, rinsing, and drying, thereby fixing the release agent to the work surface. The processing is done one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI. *For more details, please download the catalog or contact us.*
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basic information
【Main Specifications】 1. Stroke: 250mm 2. Target Size: 6inch, 8inch 3. Target Material: Wafer 4. Dip Speed: 0.1mm/sec to 10mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: No 7. Filter Mesh: 0.05μm 8. Drying Section: No 9. Drying Temperature: No 10. HEPA Unit: Yes 11. Device Size (Approx.): W: 904×D: 840×H: 1070mm
Price range
P5
Delivery Time
Applications/Examples of results
By applying a release agent to a maximum 8-inch wafer and processing it through the steps of coating, rinsing, and drying, the release agent is fixed onto the work surface.
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Company information
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