Over 10 years of experience in pattern design for build-up substrates. Our staff, equipped with advanced know-how and electrical knowledge, will handle the design.
We will submit a color-coded version of the power supply and designated signals during the inspection. This allows for easy confirmation of the distribution of power supply and GND systems, as well as signal color coding, making it easier to check routes and lengths. We will provide drawings (up to A0 size) and electronic data (PDF). Additionally, we will submit data compatible with various viewers. Numerical confirmations that were not possible with drawings or drawing data (such as component positions, pattern widths, lengths, etc.) and searching for components and signal lines within the data can be easily performed. This will help reduce the workload of the inspection process and improve accuracy. Submissions can be made at any time, not just during the final inspection, including for component placement confirmation and interim inspections.
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basic information
【Main Design Examples】 ■ Analog Circuit Boards: AV Equipment ■ Digital Circuit Boards: High-Speed Image Processing Systems, Microcontroller Processing Systems ■ High-Frequency Circuit Boards: Communication Systems, RF Systems ■ High-Density Mounting Circuit Boards: Compact Video Equipment, Camcorders ■ Build-Up Circuit Boards: Compact Video Equipment, Camcorders, Semiconductor Mounting Evaluation ■ Semiconductor Test Circuit Boards: For Various Testers, Burn-In Boards ■ High-Multilayer Circuit Boards: 10 Layers or More, Semiconductor Test Circuit Boards ■ Ultra Fine Pitch Circuit Boards: WB Compatible, L/S = 30μ/30μ ■ Displays (Panels): High Current, Thermal Countermeasures ■ FPC (Panels): Single-Sided, Double-Sided ■ Cavity Circuit Boards: High-Frequency Systems, Multilayer, WB Specifications *For more details, please contact us.
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Company information
Our main business is the design of printed circuit boards, but at the same time, we undertake a series of operations from board manufacturing to the procurement of electronic components and assembly.