High-precision measurement of thick film resist and polyimide up to 500μm thick without contact.
The KV-300/KF-10 automatic resist film thickness measurement device can perform high-precision non-contact measurements of ultra-thick resist films, which have traditionally been difficult to measure with stability. The standard automatic mapping function quickly displays the in-plane film thickness distribution of the substrate using a high-precision automatic stage. The KV-300 features an automatic R-θ stage, allowing it to accommodate 300mm substrates while minimizing its footprint. For more details, please contact us or refer to the catalog.
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basic information
**Main Features** - Non-contact measurement up to 500μm thickness - Compatible with 300mm wafers - Standard equipped with film thickness distribution mapping - Wafer thickness measurement function Si-71 **Other Features** - Automatic film thickness measurement device KV-300 for 300mm wafers → A device equipped with an automatic stage and mapping function, compatible with various substrates and irregular substrates up to a maximum of φ300mm. - Automatic film thickness measurement device KF-10 → A device equipped with an automatic stage and mapping software, compatible with substrates up to a maximum of φ200mm. Additionally, a low-cost manual stage model is available. For more details, please contact us or refer to the catalog.
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Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.
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