High precision within ±25nm3σ. No focus matrix is required.
The exposure analysis tool, phase shift focus monitor, has high precision within ±25nm 3σ. No focus matrix is required. Focus measurements can be made with existing overlay measurement devices. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ High precision within ±25nm3σ. ○ No focus matrix is required. ○ Results are not affected by exposure amount. ○ Focus measurements can be performed with existing overlay measurement devices. ○ Data collection can be automated. ○ Can be used for Statistical Process Control (SPC) and detailed analysis. ○ Can evaluate lens temperature rise, astigmatism, and field tilt. ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
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Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.
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