Case study of micro-hole processing in LCP (liquid crystal polymer) using short pulse laser.
This is an introduction to examples of through-hole processing for LCP (liquid crystal polymer).
A through hole with a diameter of 0.15 mm was processed in LCP (liquid crystal polymer) with a thickness of 0.05 mm. Compared to conventional laser processing, we achieved fine processing with less thermal impact.
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basic information
LCP (liquid crystal polymer) is widely used as a material for various printed circuit boards and electronic circuit boards. Until now, LCP laser processing has been performed using short-wavelength ultraviolet lasers such as THG lasers, which were considered to have relatively low thermal impact. However, upon closer inspection, re-melting due to processing heat was observed around the processed areas, resulting in less sharpness compared to machined products. In this instance, our company has realized an ablation laser processing method for LCP that minimizes thermal impact, allowing for sharp processing without re-melting or molten debris. Products processed using this method not only improve processing quality but also eliminate secondary processes such as cleaning, leading to reduced costs and the elimination of contaminated liquid discharge. <Features> - Due to the ablation processing, there is minimal thermal alteration, allowing for processing without re-melted areas or burrs. - It is possible to control straight holes and tapered holes. - As a non-contact processing method, there are no costs associated with tool replacement compared to mechanical processing using tools.
Price information
Prices may vary depending on processing specifications and quantities, so please feel free to contact us.
Delivery Time
※The delivery date may vary depending on processing specifications and quantities, so please feel free to contact us.
Applications/Examples of results
Electronic circuit board related
Company information
At Lips Works Co., Ltd., we provide contract micro-fine processing using ultra-short pulse lasers, as well as the design and manufacturing of laser systems. In our contract processing business, we have been quick to engage in the development of industrial ultra-short pulse lasers and have been involved in contract micro-fine processing using these lasers. We specialize in applying fine periodic structures (microtextures) to work surfaces aimed at controlling tribological properties, optical properties, and release/adhesion characteristics. We can accommodate requests from small-scale prototypes to mass production according to our customers' needs. In our system engineering business, we leverage the laser processing technology cultivated in our job shop to provide a comprehensive service from selecting laser oscillators suitable for applications, designing optical systems, devising fixtures and auxiliary equipment, to system integration. We assist in improving the precision and efficiency of the processing required by our customers. As experts in laser technology providing cutting-edge laser processing techniques, we strive to be a valuable resource for our customers, so please feel free to contact us.
![[Problem Solving] Reducing warping and burning through laser processing! Processing in fine areas.](https://image.mono.ipros.com/public/product/image/e17/2001231506/IPROS25681615608431728493.png?w=280&h=280)
