Manufacturing using the new method "thick film printing method" that embodies joining through high melting points.
The LID of package-type oscillators. Traditionally, the manufacturing method in this field has involved the assembly of Kovar and press-cut Au/Sn solder materials. We propose a new manufacturing method, "thick film printing method," which allows us to offer lower prices. The LID manufacturing in this field using the "thick film printing method" is a technique developed by our company. For more details, please contact us or download the catalog.
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【Features】 ○ LID for package-type oscillators ○ Available at a low price ○ New method that embodies bonding due to high melting point ○ Package sealing components for quartz oscillators and SAW filters Notable method as "LID" ○ Continuous printing (processing onto metal materials) 【Thick Film Materials】 ○ Gold/Tin (Au/Su) alloy: Melting point 278℃ ○ Gold/Germanium (Au/Ge) alloy: Melting point 356℃ ● For more details, please contact us or download the catalog.
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Company information
Since our founding in 1963, we have been engaged in metal processing centered on precision press processing, handling press molds and press processing through our own integrated processes. Currently, we are promoting the development and proposal of three-dimensional shapes using cold forging methods and sub-micron order parts, primarily producing components related to information devices. Additionally, since our expansion into Singapore in 1983, we have established bases in Malaysia, Indonesia, Thailand, and China. Our overseas factories have organized a group of companies for various processes and feature a distinctive production line that supplies unit-type components, which combine multiple parts, known as "module production" in the automotive industry. Moving forward, we will continue to strive for further expansion as a "development and proposal-oriented company," aiming for global business development while maintaining a foothold in Japan to meet our customers' needs.