This is an SMT carrier with excellent high heat resistance and high adhesion properties.
The PCB transport pallet "Reflow Carrier Board" allows for work to be done from cream solder printing to reflow without removing multiple FPCs, thin boards, or individual boards, thereby improving productivity. Since the boards can be securely fixed without using tape, the hassle of taping is eliminated, enhancing work efficiency. Additionally, the cost of purchasing tape can be reduced. For more details, please download the catalog.
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basic information
【Features】 ○ The entire surface of the substrate can be fixed, improving positional accuracy during solder printing. ○ Prevents warping of FPC during the reflow process, enhancing the reliability of soldering. ○ Provides electrostatic discharge protection, reducing the impact of static electricity on electronic components. ○ Excellent electrostatic discharge resistance and dimensional stability allow for repeated use. ○ Low thermal conductivity prevents temperature variations in FPC substrates due to heat dissipation, similar to metal carriers during the reflow process. ○ Capable of mounting multiple substrates, increasing work efficiency without expanding the production line by standardizing the width of the line. ● For more details, please contact us or download the catalog.
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We design and manufacture molds and tools that cater to a wide range of fields, responding to our customers' needs. We handle distinctive products based on the processing of metal products, printed circuit boards, cards, and other films and plates, accommodating not only mass production but also small-batch production of various types.
![[Case Study] Improved Work Efficiency through the Centralization of Transport Pallets!](https://image.mono.ipros.com/public/product/image/488/2001475294/IPROS94075312047185995048.png?w=280&h=280)
