We handle OEM production of finished products from substrates, LCD modules, and production equipment.
We handle OEM production of finished products from substrates, liquid crystal modules, and production equipment, as well as micro-joining technology for electronic components, and component mounting and connection using ACF and other methods. Mie Electronics is expanding its business scope based on its long experience in the assembly of electronic products, including the mounting of chip components onto substrates, the design and manufacturing of liquid crystal displays, and the design and manufacturing of mechatronics. Additionally, in the electronics field, which is advancing towards miniaturization, weight reduction, and mobility, we are focusing on "joining technologies" such as microfabrication, micro-joining technology, and high-density mounting technology. For more details, please download the catalog.
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basic information
【Products Handled】 【Implementation by ACF】 ○COF (Chip On Flex) ○COG (Chip On Glass) ○FOG (Flex On Glass) ○FOP (Flex On PET Film) ○FOB (Flex On Board) ○Implementation work in a clean environment 【Implementation of prototypes and evaluation units related to electronic devices】 ○Short delivery times ○Small lot sizes (from 1 piece) available ○Possible to accommodate ancillary work beyond implementation as much as possible ●For more details, please contact us or download the catalog.
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Company information
We undertake various implementations related to flat panel displays (LCD, organic EL, etc.) such as COF, flip chip, COG, TAB, and heat seal. In particular, we also handle small lot implementations during the research and development and prototyping stages, which can be helpful for our customers facing challenges in their research and development phases. We accept custom design and manufacturing of TN and STN specification custom LCD modules for industrial applications such as measuring instruments and medical devices, starting from small lots (1K) to custom-made solutions. Our production equipment primarily includes ACF bonding machines, and we offer semi-automatic machines. There are advantages to using them offline for research and development, prototyping, and repair purposes.
![[Board Assembly] Understand the manufacturing process from anywhere within the company.](https://image.mono.ipros.com/public/product/image/4f9/2000481970/IPROS89489323129663042555.jpeg?w=280&h=280)
