We aim to minimize the processing area, precisely and accurately reduce the altered layer, and make the subsequent processes easier and less frequent.
【Processing Results】 〇0.85t Hv=65 〇φ0.12×132 holes 〇φ0.24 & φ0.1 stepped holes 450 holes 〇φ0.345～0.347 〇φ0.123～0.127 *For more details, please download the PDF or feel free to contact us.
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Please feel free to consult us regarding precision cutting and fine precision machining. Precision machining of semiconductor and electronic components, crystal materials related to optics, and hard and brittle materials. Fine precision machining of difficult-to-cut materials such as resins, rubber, and composites. Fine precision machining related to medical applications.