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  6. Dielectric Analysis - DEA Hardening Automatic Measurement Device "LT/LTF Series"

Dielectric Analysis - DEA Hardening Automatic Measurement Device "LT/LTF Series"

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Polymer Curing Automatic Measurement Device "LT451/LTF631/LT439/LTP250"

last updated:May 01, 2024

シスコム(SysCom)
シスコム(SysCom)
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Visualizing the reaction processes of various resin materials! Continuously monitor the viscosity changes and curing progress of resin materials in-process with high sensitivity.

It provides information on resin reactions that cannot be obtained using conventional lab-scale thermal analysis devices (such as DSC, DMA, and rheometers). By conducting high-sensitivity dielectric analysis (DEA) online and in real-time during the reaction processes of various liquid resins, FRP/CFRP composites, and molding materials, it analyzes material flow, viscosity changes, gelation, degree of curing and crosslinking progress, and reaction termination, thereby offering the development of more appropriate molding conditions and quality control tests for materials. The sensors can be permanently mounted in molds and used in actual processes such as pressing, RTM (VaRTM) molding, and autoclaving for curing and reaction analysis. Compact and cost-effective models (LT-451, LTF-631, LT-439) are available to accommodate fast reactions in just a few seconds as well as long-duration reactions. Additionally, multiple sensors (1ch to 8ch) can be used simultaneously for effective evaluation of molding properties and curing behavior at multiple points. This technology can be applied from material development and quality control to production sites. For more details, please refer to the catalog and materials.

    Other physicochemical equipmentOther polymer materialsViscometer
ポリマー硬化自動測定装置.JPG

Dielectric Analysis - DEA Hardening Automatic Measurement Device "LT/LTF Series"

ポリマー硬化自動測定装置.JPG
ポリマー硬化自動測定装置.JPG DEA硬化評価装置例2.JPG 090409_87.jpg DEA装置&卓上プレス.JPG 同時計測ジグ02.JPG イオン粘度カーブ.jpg
  • Related Link - https://syscom-corp.jp/products/polymer/
  • Special site - Product/service details - https://pr.mono.ipros.com/syscom/product/

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basic information

**Features** **LT451** - A versatile high-precision dielectric cure monitor applicable from material development to production processes. - Multi-frequency sweep measurements across a wide frequency range (0.001Hz to 100KHz). - Extremely sensitive monitoring until the reaction endpoint. - Measurement of curing progress at multiple points (1ch to 8ch). - Easy application from the lab to the production line. **LTF631** - High-speed sampling for fast-curing resin materials with short reaction times (from a few seconds to a few minutes). - Effectively reduces molding cycle times. - Proven results with SMC (CF-SMC), BMC, epoxy sealants, and UV curing. - Can simultaneously utilize thermocouples, pressure sensors, displacement sensors, etc., effective for quality assurance and process development. **LT-439** - A low-cost DEA dielectric curing monitor (1ch measurement) that can be networked for application in the reaction processes of large molded parts. **LTP250** - A compact tabletop press capable of curing simulation for various resin molding materials. - Temperature control program supports up to 350°C. - Equipped with safety covers, overheating prevention controls, and measurement start triggers.

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Price range

P5

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Applications/Examples of results

【Applications】 ○ Resin ○ Adhesive ○ CF/GF Prepreg ○ CFRP Composite ○ SMC/BMC Molding ○ RTM (VaRTM Molding) ○ Sealing Material (EMC) ○ Paint ○ Coating ○ Film ○ UV Curing ○ Electronic Assembly Materials ○ Oven ○ Press ○ Autoclave ● For more details, please contact us or download the catalog.

Detailed information

  • DEA硬化評価装置例2.JPG

    Resin Cure Monitor Test Station With a compact tabletop programmable press, it is easy to conduct evaluation tests on the curing behavior, fluidity, and reactivity of liquid resins and various molding materials.

  • 090409_87.jpg

    Various types of disposable sensors that sensitively track the curing progress from coatings and molding materials to the terminal region of resin curing.

  • セラミックセンサ(横出し).JPG

    Tool Mount Sensor A heat-resistant ceramic sensor that can be permanently used by being flash-mounted on molds in various molding processes such as SMC, BMC, EMC, and RTM. Sensor sizes are available in various options, including diameters of 1 inch, 0.5 inches, and 8 mm.

  • ポリマー硬化自動測定装置LT451_LTF631.jpg

    DEA dielectric cure monitor Easy to transport from the lab to the molding site, suitable for process monitoring.

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Polymer Curing Automatic Measurement Device "LT451/LTF631"

Polymer Curing Automatic Measurement Device "LT451/LTF631"

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Revised Edition: Introducing Cisco's Unique Products [Measurement Equipment Guide]

Revised Edition: Introducing Cisco's Unique Products [Measurement Equipment Guide]

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シスコム(SysCom)

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We will contribute to research and development in various fields by introducing analysis and evaluation equipment and sensor systems based on cutting-edge technology from Europe and the United States to the domestic market. Additionally, we will provide flexible and reliable technical support to meet our customers' diverse needs. Please feel free to consult us, even about minor matters.

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