Sub-mount capable of controlling sharp edges and warping.
The "CuW Submount" is a submount for heat sink applications of high-output LD modules. It allows for control of sharp edges and warping to achieve alignment during LD bonding and efficient heat dissipation. Additionally, it enables control of excess solder during AuSn deposition in the LD bonding area. 【Features】 ■ Control of sharp edges and warping is possible ■ Control of excess solder is possible ■ Suitable for high-output semiconductor lasers *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Material】 ■Composition: W90/Cu10 ■Thermal conductivity: 170W/m･K ■Thermal expansion rate: 6.5ppm/℃ 【Precision】 ■Surface roughness: Ra<0.4 ■Warping: 5.0μm or less ■Edge R: 20.0μm or less *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Submount for high-power semiconductor lasers ■ Base for power semiconductor devices *For more details, please refer to the PDF document or feel free to contact us.
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We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.