The tray for cleaning IC substrates is ideal for cleaning individual IC substrates.
The IC substrate cleaning tray is a specialized tray used for cleaning BGA substrates. After cleaning, it can be directly transferred to a JEDEC standard tray, making it very convenient. The special rib structure minimizes the residual cleaning solution in the tray.
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basic information
The material is carbon fiber-reinforced PPE, making it durable and heat-resistant up to 150°C, as well as excellent in chemical resistance. It is treated for static electricity prevention, and its effectiveness is semi-permanent.
Price range
P1
Delivery Time
P4
Applications/Examples of results
In the IC substrate cleaning process, using this product allows for smooth transfer directly to the JEDEC standard trays for transportation. It contributes to improved work efficiency.
Line up（10）
| Model number | overview |
|---|---|
| SCT-BGA1515-1 | □15x15mm board use |
| SCT-BGA1818-1 | □18x18mm board use |
| SCT-BGA1919-1 | □19x19mm board use |
| SCT-BGA2323-1 | □23x23mm board use |
| SCT-BGA2727-1 | □27x27mm board use |
| SCT-BGA3030-1 | □30x30mm board use |
| SCT-BGA3535-1 | □35x35mm board use |
| SCT-BGA375375-1 | □37.5x37.5mm board use |
| SCT-BGA4040-1 | □40x40mm board use |
| SCT-BGA425425-1 | □42.5x42.5mm board use |
catalog（1）
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Company information
Shinon Electric Industry Co., Ltd. prioritizes the safety of the global environment and society as its foremost challenge, and all employees work together to develop technologies for environmental conservation and social safety, contributing to the construction of a safe society while effectively utilizing limited resources.