The diamond cutting wire is a new product developed through our unique research and development. The quality of the product has reached a world-leading level.
The product is used for cutting with a power supply that supports the instruction manual in a multi-wire cutting machine line, which can replace the optical polishing processing process. It is for precision cutting of artificial crystals, ceramics, quartz glass, single crystal silicon, polycrystalline silicon, sapphire, and special metal materials. Technical parameters: 1. Diameter: 0.12 to 0.36 millimeters, with a diameter deviation of ≤0.01 millimeters. 2. Base material: cutting of high-tensile steel wire. 3. Size of diamond abrasives: from below 5μm to 60μm, we can design according to customer requirements. 4. Tensile strength: 3200 to 3400 MPa. 5. Wire length: we can process according to user requirements.
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Price information
The price varies depending on the quantity, so please feel free to contact us.
Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Precision cutting of artificial crystals, ceramics, quartz glass, single crystal silicon, polycrystalline silicon, sapphire, and special metal materials.
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Company information
We are still selling consumables for high-tech industries, such as various types of optical lenses.